Z-axis pressure mount connector fixture

ABSTRACT

An electro-optical connector is described that provides a separable electrical interface for connecting to a circuit board. The optical connection between the fiber and the connector are semi-permanent. Also described is an electro-optical system that transfers signals between two circuit board over an optical fiber where the separable interface within the system is electrical rather than optical. Further described is a fixture with pivoting actuation and retraction for connecting a z-axis pressure mount connector to a circuit board.

BACKGROUND OF THE INVENTION

Electrical connectors are used in many electronic systems. It isgenerally easier and more cost effective to manufacture a system onseveral printed circuit boards that are then joined together withelectrical connectors. A traditional arrangement for joining severalprinted circuit boards is to have one printed circuit board serve as abackplane. Other printed circuit boards, called daughter boards, areconnected through the backplane.

A traditional backplane is a printed circuit board with many connectors.Conducting traces in the printed circuit board connect to signal pins inthe connectors so signals may be routed between the connectors. Daughterboards also contain connectors that are plugged into the connectors onthe backplane. In this way, signals are routed among the daughter boardsthrough the backplane. The daughter cards often plug into the backplaneat a right angle. The connectors used for these applications contain aright angle bend and are often called “right angle connectors.”

Connectors are also used in other configurations for interconnectingprinted circuit boards, and even for connecting cables to printedcircuit boards. Sometimes, one or more small printed circuit boards areconnected to another larger printed circuit board. The larger printedcircuit board is called a “mother board” and the printed circuit boardsplugged into it are called daughter boards. Also, boards of the samesize are sometimes aligned in parallel. Connectors used in theseapplications are sometimes called “stacking connectors” or “mezzanineconnectors.”

Regardless of the exact application, electrical connector designs havegenerally needed to mirror trends in the electronics industry.Electronic systems generally have gotten smaller and faster. They alsohandle much more data than systems built just a few years ago. Thesetrends mean that electrical connectors must carry more and faster datasignals in a smaller space without degrading the signal. Constraintsimposed by the geometries of backplanes designed for certainapplications however, reduce the options available for possibleconnector solutions.

For example, thick, large backplanes make some surface mount connectorsimpractical as the number of layers in the board hinders raising theboard to a temperature necessary to solder the leads to the board. Pressfit connectors require larger vias. As via diameters increase, thecapacitance of the via also increases thus making an impedance matchbetween the connector and the characteristic impedance of a transmissionline on the backplane more difficult.

Connectors which make contact through pressure are sometimes referred toas “pressure mounted” or z-axis pressure mount connectors as thepressure applied to the connector to provide the desired contact istypically exerted in the z-axis direction. These pressure mountconnectors provide the low electrical parasitics desired by currentindustry trends.

Connectors that join optical fibers to create a low loss, separableoptical interface have been available and in use for a number of years.

These connectors use a variety of ferrule types, alignment schemes andlatching mechanisms for joining solitary strands of single-mode andmulti-mode optical fiber as well as a multiplicity of fibers in a ribbonform. An example of the second is typified by the “MT” style arrayferrules. Each of these connectors join the fibers end to end using avariety of alignment techniques. For single fiber joints, an alignmentferrule generally surrounds and guides the fiber-ends together.

One application of optical connector technology is to provide an opticalpath for signals from board to board, or shelf to shelf within equipmentchassis. This optical path is provided by passing optical fibersperpendicularly through a backplane, using so-called “pass through”optical connectors. A right angle mounting of connectors join theoptical fibers from an optical module on the daughtercard to opticalfibers in cables running out of a card rack. This right angle mountingrelies upon a blind mating of the fibers and must conform to standardcable management conventions such as minimum bend radius that contributeto box volume requirements behind the backplane.

As the need for bandwidth capacity increases, “Optical Backplanes”usually in the form of laminated fiber matrices that overlay thebackplane or that supplement the backplane are also being used. Theseoptical backplanes, likewise have their fibers terminated to standard“pass through” optical connectors as previously described.

SUMMARY OF THE INVENTION

Current means for actuating z-axis pressure mount connectors typicallyinvolved bolting the circuit board, connector, and second circuit boardtogether with screws and a form of reinforcing plate. Due to the natureof the fixturing used, these types of interfaces do not typically lendthemselves to traditional, right angle daughtercard/backplaneinterfaces.

The current implementations of “optical backplane” or intra-box opticalconnections suffer as a result of the nature of the “pass through”optical interface onto the equipment backplane. A 90 degree turn by theoptical fiber on the backplane is required. Current optical fibertechnology requires the design to maintain a bend radius of greater thanone inch to avoid optical loss and mechanical fatigue that can causebreakage. Fixtures that control the fiber bend radius are typicallyused. These fixtures gradually turn the fiber parallel to the backplanein order to plug to an overlay. Alternatively, fibers may be looped fromone perpendicular “pass through” to another to effect slot to slotconnectivity. Both of these options, however, consume considerable spacebehind the traditional electrical backplane while radius fixtures addadditional cost to the system.

One solution described in the following disclosure provides a connectorfixture for enabling a z-axis, pressure mount connection. The connectorfixture includes a slot, an actuator, responsive to engagement by acircuit board inserted into the slot and a loading spring, responsive torotation of the actuator, for compressing against a surface of a z-axis,pressure mount connector. With such an arrangement, a pressure mountconnector can be used in a right angle mounting configuration.

Another solution described in the following disclosure provides aconnector fixture for enabling an electro-optical connection. Theconnector fixture includes a slot, an actuator, responsive to engagementby a circuit board inserted into the slot, a channel for accepting anoptical fiber and a loading spring, responsive to rotation of saidactuator, for compressing against a surface of the electro-opticalconnector. With such an arrangement, a means for launching into anoptical fiber positioned perpendicular to the circuit board isfacilitated.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other objects, features and advantages of theinvention will be apparent from the following more particulardescription of an Electro-Optic Connector Module, as illustrated in theaccompanying drawings in which like reference characters refer to thesame parts throughout the different views. For clarity and ease ofdescription, the drawings are not necessarily to scale, emphasis insteadbeing placed upon illustrating the principles of the invention.

FIG. 1 is a block diagram of an electro-optical connection according toan embodiment of the invention.

FIG. 2 is a pictorial representation of one embodiment of anelectro-optical module.

FIG. 3 is a pictorial representation of an alternate embodiment of theelectro-optical module.

FIG. 4 is a pictorial representation of an electro-optical connectionsystem.

FIG. 5 is an exploded view of a general purpose z-axis pressure mountconnector fixture.

FIG. 6 is a cross-sectional view of the connector fixture of FIG. 5

FIG. 7 is a cut-away view of the connector fixture of FIG. 6.

FIG. 8 is a pictorial representation of an alternate embodiment of aconnector fixture used to mate the electro-optical module with a circuitboard.

FIG. 9 is a cross-sectional view of the connector fixture of FIG. 7.

FIG. 10 is an exploded view of the connector fixture of FIG. 7 when usedin conjunction with the electro-optical module of FIG. 2.

FIG. 11 is an exploded view of the connector fixture of FIG. 7 when usedin conjunction with the electro-optical module of FIG. 3.

FIG. 12 is a pictorial representation of an alternate embodiment forrouting the optical fibers.

FIG. 13 is a pictorial representation of a connector fixture used incombination with the electro-optical module of FIG. 4.

DETAILED DESCRIPTION OF THE INVENTION

The electro-optical connection 10 of FIG. 1 includes a circuit board 12,an electro-optical module 24 and an optical fiber or an array of opticalfibers 22. The circuit board 12 and the electro-optical module 24 areconnected through a separable, electrical connection 18. Theelectro-optical module 24 and the optical fiber 22 are connected througha semipermanent optical connection 26.

The electro-optical module 24 is shown to include a routing substrate 14and an optical interface 16. The routing substrate is connected to theoptical interface 16 through a fixed connection 20.

In the configuration of FIG. 1, an electrical signal passes from asignal trace (not shown) within the circuit board 12 through theseparable, electrical interface 18 to the electro-optical module 24.Within the electro-optical module 24, the electrical signal is passedfrom the routing substrate 14, through the fixed connection 20 to anoptical interface 16. The optical interface 16 converts the electricalsignal to an optical signal which is transferred to the optical fiber 22through the semi-permanent optical connection 26. The electro-opticalconnection system 10 also operates in reverse wherein an optical signaltraveling through the optical fiber 22 to the optical interface 16 isconverted to an electrical signal. The electrical signal passes throughthe fixed connection 20 to the routing substrate 14 and through theseparable, electrical interface 18 to a signal trace on the circuitboard 12.

Generally, in an electro-optical connection system, the separableinterface in the system is a mating between two optical fiber ends.Here, however, the separable interface is provided by an electricalconnection, thus avoiding the problems encountered with fiber to fiberconnections such as alignment issues and dust contamination. Thesemi-permanent connection between the optical fiber and theelectro-optical module can be provided in a controlled factory settingallowing for better alignment and, when done in a dust free environment,minimal risks of contamination. The semi-permanent nature of theconnection is generally provided to enable future servicing and repairsto the connection and/or components.

Referring now to FIG. 2, a pictorial representation of anelectro-optical connection 30 between a circuit board 12 and an opticalfiber 22 a, 22 b is shown to include one embodiment of theelectro-optical module 24.

Here, the circuit board 12 is functionally shown as a daughtercard.Here, the optical fiber is shown as an input/output fiber pair 22 a, 22b however an optical fiber array can be substituted as well as any otherdesirable configuration of the optical fibers. Also shown is a backplane29. The electro-optical module 24 is shown spaced from the daughtercardin a unmated position.

The electro-optical module 24 is shown to include a routing substrate 14and an optical interface mounted on a front surface of the routingsubstrate 14. The optical fiber pair 22 a, 22 b is connected to theoptical interface 16 by a semi-permanent optical connection 26. In thisway, the electro-optical module 24 provides a means for launching intoan optical fiber positioned perpendicular to the circuit board 12.

Referring also to FIG. 2A, the separable, electrical connection 18 isprovided on a back surface of the routing substrate 14. The separable,electrical connection 18 is preferably provided by a z-axis, pressuremount connector. Here, the separable, electrical connection 18 is shownas an array of self-retained pressure connectors 34 located on the backsurface of the routing substrate 14. These pressure connectors 34, anexemplary one shown in FIG. 2B, are small metallic structures which arepressed into plated through holes (not shown) in the routing substrate14. Surface contacts 36 a, 36 b (FIG. 2B) contact pads (not shown) onthe surface of circuit board 12. These multiple contact surfaces 36 a,36 b provide multiple points of contact with the circuit board 12surface pads thus providing a reliable electrical contact.

One benefit of using these small pressure connectors 34 is that smallcontact pads can be used on the circuit board surface and further, smallplated through holes or vias can be used on the routing substrate 14.The small dimensions of these features allow for the separable,electrical connection 18 between the circuit board 12 and the routingsubstrate 14 to be optimized for low electrical parasitics.

In an alternate embodiment, a so-called mezzanine or stacking connectorconfigured to provide the desired electrical signal properties can beused as the separable, electrical connection 18 between the circuitboard 12 and the routing substrate 14. These connectors typicallyprovide an electrical connection between two parallel circuit boardsurfaces.

Referring back to FIG. 2, the optical interface 16 includes an opticaltransceiver (not shown) and an optical/mechanical connection between theoptical transceiver and optical fiber pair 22 a, 22 b. Typically, theoptical transceiver responds to an analog signal rather than a digitalsignal as is typically communicated through a circuit board. Here, toprovide and/or interpret the analog signal, driver electronics 28 forthe optical transceiver are mounted on the circuit board 12. Typically,these driver electronics 28 are digital to analog converters packaged inan Application Specific Integrated Circuit (ASIC). The driverelectronics 28 convert a digital signal being passed through the signaltrace on the circuit board 12 to an analog current which drives theoptical transceiver and vice versa.

The mechanical connection between the optical fibers and the opticaltransceiver can generally be done in a controlled factory setting.Alignment of the fibers to the optical transceiver performed in a dustfree environment eliminates contamination at the end of the fiber, thusminimizing optical losses. A permanent connection can be providedbetween the optical fibers and the optical transceiver or asemi-permanent optical connection 26 as described in conjunction withFIG. 1.

In a preferred embodiment, the optical transceiver is an array of VCSELelements. A VCSEL converts between an analog electrical signal and anoptical signal. In an alternate embodiment, other opto-electrical (O/E)sources may be used in conjunction with photo detectors to provide theoptical transceiver component of the optical interface 16.

Referring now to FIG. 3, a pictorial representation of anelectro-optical connection 40 between a circuit board 12 and an opticalfiber is shown to include an alternate embodiment of the electro-opticalmodule 24′.

The electro-optical module 24′ includes a routing substrate 14. Mountedon a back surface of the routing substrate is a separable, electricalconnection 18. An optical interface 16 is mounted on the front surfaceof the routing substrate with the optical fiber pair 22 a, 22 b beingconnected to the optical interface 16 by a semi-permanent opticalconnection 26.

Here, further included in the electro-optical module 24′ are the driverelectronics 28 for the optical source/driver which are mounted on therouting substrate 14. Mounting the driver electronics 28 on the routingsubstrate 14 frees up additional space on the daughtercard. In addition,it eases the transmission of the analog signals from the driverelectronics to the optical source/driver.

In an alternate embodiment (not shown) the optical interface 16 can bemounted on the driver electronics 28 rather than on the routingsubstrate 14.

Referring now to FIG. 4, a pictorial representation of anelectro-optical connection system 45 that provides an electro-opticalconnection between a first circuit board 12 a and a second circuit board12 b is shown. Here, the electro-optical connection system 45 is shownto include two electro-optical modules 24 a, 24 b.

Included in the first electro-optical module 24 a is a first routingsubstrate 14 a. Mounted on the routing substrate 14 a is a first opticalinterface 16 a located on a front surface and a second optical interface16 c located on a lower back surface. Optical interfaces 16 a, 16 c areprovided on either side of the routing substrate 14 a to enable thefirst circuit board 12 to communicate with circuit boards located oneither side of the first circuit board 12 without requiring a bend inthe optical fiber.

The first routing substrate 14 a also includes a separable, electricalconnection 18 a provided on an upper back surface of the routingsubstrate 14 a. Here, the separable, electrical connection 18 a is shownas an array of self retained pressure connectors. The separable,electrical connection 18 a provides electrical contact between theelectro-optical module 24 a and the first circuit board 12 a. Theoptical fiber pair 22 a, 22 b is connected to the optical interface 16 aby a semi-permanent optical connection 26 a. Mounted on the circuitboard 12 a are the driver electronics 28 a for an optical transceiverincluded in the optical interface 16 a.

The second optical interface 16 b is connected at a distal end of theoptical fiber pair 22 a, 22 b by a second semi-permanent opticalconnection 26 b. A third optical interface 16 b is mounted on a frontsurface of a second routing substrate 14 b. A fourth optical interface16 d is mounted on a lower back surface of the second routing substrate14 b to enable the second circuit board 12 b to communicate with anothercircuit board located on its other side. The second routing substrate 14b connects to the second circuit board 12 b through a separable,electrical interface 18 b, also shown as an array of self retainedpressure connectors, provided on an upper back surface of the routingsubstrate 14 b. Mounted on the surface of the second circuit board 12 bare the driver electronics 28 b for an optical transceiver included inthe optical interface 16 b.

In an alternate embodiment, the driver electronics 28 a, 28 b aremounted on their respective routing substrates 14 a, 14 b rather than onthe circuit boards 12 a, 12 b.

The electro-optical connection system 45 described above provides asolution to many of the problems faced by current electro-opticalconnection systems. Multiple mating cycles of traditional opticalconnectors degrade the performance of the connection and introduce, overtime, additional signal losses into the system as guidance featuresaiding in the alignment between the two mating surfaces become worn. Inaddition, dirt and dust can become an increased contamination problemunless strict cleaning procedures are adhered to and even then, maystill compound over time. Here, the wear and tear of multiple matecycles are born by a separable, electrical connection 18 lesssusceptible to alignment issues and dirt and dust contamination. Thissystem further eliminates the need to bend optical fibersperpendicularly to route them between daughtercards or adjacentbackplanes thus eliminating significant volume associated with bendradius.

Referring now to FIG, 5, an exploded view of a general purpose, z-axispressure mount connector fixture 75 is shown to include a circuit boardreceiving slot 51, an actuator 56, and a loading spring 54. The circuitboard 12 engages an activation surface 62 when inserted into thereceiving slot 51, causing the actuator to pivot around a pivot pin 52included on the actuator 56. The pivoting action presses a face 53against the loading spring 54, compressing the spring 54 thus, applyinga perpendicular force against a first surface of a mezzanine board ordaughtercard 70.

The perpendicular force applied by the loading spring 54 presses anopposing face of the mezzanine board 70 against a surface of the circuitboard 12 thus engaging a z-axis pressure connector 71 with acorresponding mating surface.

For example, in one embodiment, the z-axis pressure connector 71 is anarray of self-retained pressure connectors 34 (FIG. 2A). Thecorresponding mating surface is an array of pads located on the surfaceof the circuit board 12. The perpendicular force flattens the contactsurfaces 36 a, 36 b (FIG. 2A) of each self-retained pressure connector34 against a corresponding pad on the circuit board 12 thus providing anelectrical connection between the mezzanine board 70 and the circuitboard 12.

Referring now to FIG. 6, a cross-sectional view of the connector fixture75 illustrates a preloaded position 58 a of the actuator 56. Prior toinsertion of the circuit board 12, the actuator 56 is in the preloadedposition 58 a. When the circuit board 12 is inserted into the slot 51 inthe connector fixture, the circuit board 12 engages the actuator 56causing the actuator 56 to rotate. The actuator 56 rotates around thepivot pin 52 until it locks into its loaded position 58 b. In the loadedposition 58 b, a face 53 of the actuator 56 compresses the loadingspring 54, thus applying a perpendicular force against the mezzanineboard 70. The perpendicular force caused by the loading spring 54 causesthe array of z-axis pressure connectors 71 to mate with a correspondingmating surface (not shown) on the circuit board 12.

Referring now to FIG. 7, a cut-away view of the connector fixture 50exposes an actuator retract spring 60. The actuator retract spring 60aids in rotating the actuator 56 back to its preloaded position 58 awhen the circuit board 12 is removed. Specifically, when the circuitboard 12 is removed from the slot 51, the actuator retract spring 60exerts a force against the actuator 56 causing it to rotate in aclockwise direction until it comes to rest in its preloaded position 58a (FIG. 6).

Referring now to FIG. 8, a pictorial representation of an alternateembodiment of a connector fixture 50′ used to mate the electro-opticalmodule 24 with the circuit board 12 is shown. The connector fixture 50′is shown to include a channel 67 through which the optical fiber pair 22a, 22 b passes. The circuit board 12 is inserted into slot 51 in theconnector fixture 50′. Once inserted, the actuator 56 (FIG. 5) withinthe body of the connector fixture pivots around the pivot pin 52 causingthe loading spring to exert a force against the routing substrate 14which, in turn, presses the routing substrate 14 against the circuitboard 12.

Referring now to FIG. 9, a cross-sectional view of the connector fixture50′ illustrates both a preloaded position 58 a and a loaded position 58b of the actuator 56. Prior to insertion of the circuit board 12, theactuator 56 is in the preloaded position 58 a. As the circuit board 12is inserted into the slot 51 in the connector fixture, the circuit board12 presses against an activation surface 62 on the actuator 56. Theforce against the activation surface 62 causes the actuator 56 torotate, here, counter-clockwise around the pivot pin 52 until it locksinto its loaded position 58 b. In the loaded position 58 b, a face 53 ofthe actuator 56 compresses the loading spring 54, thus applying aperpendicular force against the routing substrate 14. The perpendicularforce caused by the loading spring 54 causes the array of self-retainedpressure connectors 18 to mate with surface pads (not shown) on thecircuit board 12.

Referring now to FIGS. 10 and 11 exploded views of the connector fixtureare shown when used in conjunction with the electro-optical module 24 ofFIG. 2 (FIG. 10) and with the electro-optical module 24′ of FIG. 3 (FIG.11). In both FIGS. 10 and 11, the pivot pin 52 can be seen to extendacross the length of the actuator 56 extending beyond each side face 55a, 55 b of the actuator 56. These extended portions of the pivot pin 52rest within grooves 64 a, 64 b in a bottom portion of the connectorfixture body 49 a. The top portion of the connector fixture body 49 bincludes a similar groove 65 a, (65 b is not visible). The actuator 56then rotates within these grooves 64 a, 64 b 65 a, 65 b around the pivotpin 52. Also provided are wells 66 on each side of the bottom portion 49a of the connector fixture body to provide clearance for the actuator 56as it rotates.

In the configuration of FIG. 10, the loading spring 54 presses againstthe routing substrate 14 when the actuator 56 is in the loaded position58 b (FIG. 8). In the configuration of FIG. 11 however, the loadingspring 54 presses against the driver electronics package 28 when theactuator 56 is in the loaded position 58 b (FIG. 8). An optionalreinforcement plate (not shown) can also be used in conjunction with theloading spring 54 to protect the driver electronics package 28 frombeing damaged by the spring 54.

Referring now to FIG. 12 a pictorial representation of an alternateembodiment for routing the optical fiber pair 22 a, 22 b is shown. Here,the backplane 29 includes a backplane cutout 72 through which a routingsubstrate 74 extends. The optical interface 16 is mounted on thesubstrate 74 however here, the optical fibers are routed on a back sideof the backplane 29. This embodiment enables easy maintenance from theback side of the backplane 29 and greater flexibility in routing theoptical fibers.

For example, using the backplane cutout 72 configuration, routing ofoptical fibers need not be limited between adjacent daughtercards butrather may be extended between daughtercards that are not adjacent asintermediate daughtercards would not be an obstacle to the routing.Typically, a “daughtercard connector void” is provided where the opticalfibers pass by the daughtercard. A “daughtercard connector void” is alocation on the daughtercard where no connector is located providing aspace between the edge of the daughtercard and the surface of thebackplane. It is through this space that the optical fiber passes.

Referring now to FIG. 13, a pictorial representation of a connectorfixture 50″ used in combination with the electro-optical module 24 a(FIG. 4) is shown. The connector fixture 50″ is shown to include asecond channel 76 through which a second optical fiber pair 22 c, 22 dpass. The second optical fiber pair 22 c, 22 d are semi-permanentlyconnected to a second optical interface 16 c (FIG. 4) located on a lowerback surface of the first routing substrate 14 a (FIG. 4).

While this invention has been particularly shown and described withreferences to preferred embodiments thereof, it will be understood bythose skilled in the art that various changes in form and details may bemade therein without departing from the scope of the inventionencompassed by the appended claims.

What is claimed is:
 1. A connector fixture for enabling a z-axis,pressure mount connection, the connector fixture comprising: a slot; anactuator, responsive to engagement by a circuit board inserted into saidslot; and a loading spring, responsive to rotation of said actuator, forcompressing against a surface of a z-axis, pressure mount connector; anda retraction spring, responsive to removal of the circuit board fromsaid slot.
 2. The connector fixture of claim 1 further comprising: achannel for accepting an optical fiber.
 3. A connector fixture forenabling an electro-optical connection, the connector fixturecomprising: a slot; an actuator, responsive to engagement by a circuitboard inserted into said slot; a channel for accepting an optical fiber;and a loading spring, responsive to rotation of said actuator, forcompressing against a surface of the electro-optical connector.
 4. Theconnector fixture of claim 3 further comprising: a retraction spring,responsive to removal of the circuit board from said slot.
 5. Anelectro-optical connection system including a fixture according to claim3, the electro-optical connection system further comprising anelectro-optical module disposed between the loading spring and the slot,the electro-optical module having electrically conductive inputs facingthe slot and an optical output facing the channel for accepting anoptical fiber.
 6. The electro-optical connection system of claim 5additionally comprising a fiber affixed to the electro-optical modulepassing through the channel.
 7. An electro-optical connection systemcomprising: a) a first circuit board and a second circuit board, each ofthe circuit board having a surface with electrical contact pointsthereon; b) a first fixture and a second fixture for receiving arespective one of the printed circuit boards, wherein each fixturecomprises: i) an electro-optical module, the electro-optical modulehaving an electrical interconnect and an optical interconnect; ii) asupport for releasably holding the respective printed circuit board;iii) a movable member coupled to the electro-optical module, the movablemember being movable toward and away from the support; and iii) abiasing mechanism, biasing the electrical interconnects of theelectro-optical module into engagement with the respective printedcircuit board; c) optical fiber between the fiber optic interconnect ofthe electro-optical module of the first fixture and the second fixture.8. The electro-optical connection system of claim 7 wherein the biasingmechanism comprises a spring.
 9. The electro-optical connection systemof claim 7 wherein the movable member comprises a pivoting actuator. 10.The electro-optical connection system of claim 7 wherein the biasingmechanism is attached to the movable member.
 11. The electro-opticalconnection system of claim 7 further comprising a substrate with anupper surface on which the first fixture and the second fixture aremounted and a lower surface, with the fiber optic interconnect runningalong the lower surface.
 12. The electro-optical connection system ofclaim 7 wherein there is a pressure contact between the electricalcontact points on the first and second printed circuit boards and theelectrical interconnect of the respective electro-optical modules. 13.The electro-optical connection system of claim 7 wherein eachelectro-optical module includes a routing substrate and an opticalinterface.
 14. The electro-optical connection system of claim 13 whereinthe routing substrate includes pressure contacts thereon.
 15. Theelectro-optical connection system of claim 7 wherein there is aseparable interface between each electro-optical module and a respectiveprinted circuit board.
 16. The electro-optical connection system ofclaim 15 wherein there is a semi-permanent connection between eachoptical interconnect and the optical fiber.
 17. The electro-opticalconnection system of claim 7 wherein the movable member rotates about apivot point and the rotation is actuated by insertion of a printedcircuit board into the respective fixture.